Semiconductor Engineering10h
Partitioning In The Chiplet Era
Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal ...
Semiconductor Engineering10h
TSMC’s Plan For Closing The Communication Gap
TSMC held its North American Open Innovation Platform (OIP) Ecosystem Forum at the Santa Clara County Convention Center on ...
Semiconductor Engineering1d
Working With Chiplets
The path forward is now heterogeneous chiplets targeted at specific markets, and while logic will continue to scale, other ...
Semiconductor Engineering3d
Barriers To Chiplet Sockets
Perfection sometimes stands in the way of progress, and there is evidence this may be happening with chiplets. It may be time ...
Semiconductor Engineering2d
Research Bits: Oct. 1
Rust-resistant coating for 2D semiconductors; polymeric material for data storage and encryption; quantum-secure deep ...
Semiconductor Engineering7d
Using AI To Glue Disparate IC Ecosystem Data
Why the chip industry is so focused on large language models for designing and manufacturing chips, and what problems need to ...
Semiconductor Engineering3d
Data Routing In Heterogeneous Chip Designs
Ensuring data gets to where it’s supposed to go at exactly the right time is a growing challenge for design engineers and ...
Semiconductor Engineering8d
UMI Can Scale the Memory Wall
UMI to OCP as an extension to the BoW standard. While the improvements in processor performance to enable the incredible ...
Semiconductor Engineering5d
Fine-Grained Functional Partitioning For Low Level SRAM Cache in 3D-IC designs (imec)
A new technical paper titled “Towards Fine-grained Partitioning of Low-level SRAM Caches for Emerging 3D-IC Designs” was ...
Semiconductor Engineering9d
Optimizing Wafer Edge Processes For Chip Stacking
Several critical processes address wafer flatness, wafer edge defects and what's needed to enable bonded wafer stacks.
Semiconductor Engineering6d
Dualtronics: Photonic Devices on the Cation Face and Electronic Devices on the Anion Face of the Same Wafer
A new technical paper titled “Using both faces of polar semiconductor wafers for functional devices” was published by ...
Semiconductor Engineering10d
Models for Both Strained and Unstrained GAA FETs Using Neural Networks
A new technical paper titled “Impact of Strain on Sub-3 nm Gate-all-Around CMOS Logic Circuit Performance Using a Neural ...